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System x iDataPlex dx360 M3: Overview

Highlights

 System x iDataPlex dx360 M3: Overview

Designed for data centers that require high performance, yet are constrained on floor space, power and cooling infrastructure, the IBM System x iDataPlex dx360 M3 provides an innovative, half-depth solution optimized for maximum density and incredible efficiency. Featuring the latest Intel Xeon Processor 5600 series with 16 DDR-3 DIMM sockets and two PCIe x16 Gen 2 slots, the dx360 M3 is easy to manage and delivers outstanding performance in a flexible platform that can be tailored to your data centers processing, storage or I/O needs.

For high performance computing, the dx360 M3 allows you to pack accelerated processing into the same power and cooling envelope as traditional servers, better utilizing floor space and optimizing the data center. The flexible design of the dx360 M3 integrates the right compute, storage or I/O capabilities required in your data center while optimizing density.

The innovative, shallow-depth form factor of the dx360 M3 reduces the airflow required across the components, lowering the power needed for cooling. High-efficiency power supplies, larger, better-optimized fans in the 2U chassis, and power management capabilities provide further efficiencies to minimize the dx360 M3s power requirements.

The dx360 M3 is simple to manage on a server level or at a rack level as part of an iDataPlex rack. IBM ToolsCenter provides common management across all System x servers, making the dx360 M3 easy to incorporate into your data center.

Common features

Hardware summary

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